RT Conference Proceedings
T1 SPS Co-Sintering Of Metal-Ceramic Composites For High Performance Electronic Applications
A1 Lores, Asier
A1 Lagos, Miguel Angel
A1 Agote, Iñigo
A1 Leizaola, Iñaki
A1 Neubauer, Erich
A1 Kovacova, Zuzana
A1 Wallis, Christopher
A1 Bringer, Charlotte
AB Electronic packages and sensors for special purpose applications demands the use of high electrical resistivity ceramics and conductive metallic materials which are sometimes difficult to be compatibilized, and whose manufacturing process involves many different processing steps. In this study, a bi-material composite consisting on a resistive SiC-Feldspar ceramic with around 109Ω.cm and a conductive Invar36 alloy has been developed in a one-step process by Spark Plasma Sintering (SPS). The SPS process permits the fast co-sintering of the composite achieving near full densities. Also, it has been observed that the joining interface of the material is stable and crack free. Both selected ceramic and metallic materials have low and similar CTE values (3.5 ppm/K), which makes them ideal for co-processing purposes and also for applications where high dimensional stability is required.
PB European Powder Metallurgy Association (EPMA)
SN 9781899072552
YR 2022
FD 2022
LK https://hdl.handle.net/11556/1749
UL https://hdl.handle.net/11556/1749
LA eng
NO Lores , A , Lagos , M A , Agote , I , Leizaola , I , Neubauer , E , Kovacova , Z , Wallis , C & Bringer , C 2022 , SPS Co-Sintering Of Metal-Ceramic Composites For High Performance Electronic Applications . in World PM 2022 Congress Proceedings . World PM 2022 Congress Proceedings , European Powder Metallurgy Association (EPMA) , World PM 2022 Congress and Exhibition , Lyon , France , 9/10/22 .
NO conference
NO Publisher Copyright: © European Powder Metallurgy Association (EPMA)
NO The Authors would like to kindly acknowledge the ESA due to the given financial support. The present work has been developed within the SiCPack project under the contract Nr. 4000128027/19/NL/CRS
DS TECNALIA Publications
RD 31 jul 2024