TY  - CONF
AU  - Barcena, J.
AU  - Merveille, C.
AU  - Maudes, J.
AU  - Vellvehi, M.
AU  - Jorda, X.
AU  - Obieta, I.
AU  - Guraya, C.
AU  - Bilbao, L.
AU  - Jiménez, C.
AU  - Coleto, J.
PY  - 2006
DO  - 10.2514/6.iac-06-c2.8.07
SN  - 9781605600390
UR  - https://hdl.handle.net/11556/2508
AB  - Devices based on wide-bandgap semiconductors such as SiC or GaN allow high power densities and elevated working temperatures. Here we present an innovative package for high-power electronics, within the framework of an ESA-contracted project. The...
LA  - eng
PB  - American Institute of Aeronautics and Astronautics Inc.
TI  - Innovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applications
TY  - conference output
ER  -