TY  - CONF
AU  - Holgado, I.
AU  - Ortega, N.
AU  - Perez, B.
AU  - Florez, S.
AU  - Plaza, S.
A4  - Leach, Richard K.
A4  - Akrofi-Ayesu, A.
A4  - Nisbet, C.
A4  - Phillips, Dishi
PY  - 2022
SN  - 9781998999118
UR  - https://hdl.handle.net/11556/2209
AB  - In emerging technologies such as aerospace and aeronautics the joining of multi-material parts is a growing need for the development of components with improved properties. Among efficient joining technologies, adhesive bonding is considered an...
LA  - eng
PB  - euspen
TI  - CT-based traceable interface area detection in Al7075-T6 adhesive bonded structures
TY  - conference output
ER  -