TY  - CONF
AU  - Fuste, N.
AU  - Avino, O.
AU  - Vellvehi, M.
AU  - Perpina, X.
AU  - Godignon, P.
AU  - Seddon, R.
AU  - Obieta, I.
AU  - Maudes, J.
AU  - Jorda, X.
PY  - 2020
DO  - 10.1109/EuroSimE48426.2020.9152713
SN  - 9781728160498
UR  - https://hdl.handle.net/11556/2773
AB  - Diamond is one of the best wide band-gap semiconductor materials available for high power devices development in terms of high current capability, high temperature operability, breakdown voltage and switching speed. Unfortunately, fabrication...
LA  - eng
PB  - Institute of Electrical and Electronics Engineers Inc.
TI  - Simulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devices
TY  - conference output
ER  -