RT Conference Proceedings
T1 Simulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devices
A1 Fuste, N.
A1 Avino, O.
A1 Vellvehi, M.
A1 Perpina, X.
A1 Godignon, P.
A1 Seddon, R.
A1 Obieta, I.
A1 Maudes, J.
A1 Jorda, X.
AB Diamond is one of the best wide band-gap semiconductor materials available for high power devices development in terms of high current capability, high temperature operability, breakdown voltage and switching speed. Unfortunately, fabrication technology for diamond devices is still experimental and immature. Furthermore, one of the most critical fields to be addressed for practical diamond devices implementation concerns the development of power packaging solutions, given that limitations in the device packaging would hinder the performance of the device and act as the limiting factor for a technology that is still in a development state. Of special interest are the induced stresses and deformations caused by the thermo-mechanical mismatch between materials. These stresses and strains will be considerably different than the ones obtained with silicon or SiC dies, and it will be especially noticeable in high temperature applications due to the higher temperature swings and the reliability constraints that arise from the coefficient of thermal expansion mismatch and stiffness difference. In this paper, a Finite Element Method for thermo-mechanical simulation of a high-temperature thermal cycle for a full-stacked diamond die SOT-227 power module is introduced and compared to silicon- and SiC-die modules. Special interest is addressed to the analysis of stress and deformations generated in the die and die-attach solder layer.
PB Institute of Electrical and Electronics Engineers Inc.
SN 9781728160498
YR 2020
FD 2020-07
LK https://hdl.handle.net/11556/2773
UL https://hdl.handle.net/11556/2773
LA eng
NO Fuste , N , Avino , O , Vellvehi , M , Perpina , X , Godignon , P , Seddon , R , Obieta , I , Maudes , J & Jorda , X 2020 , Simulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devices . in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 . , 9152713 , 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 , Institute of Electrical and Electronics Engineers Inc. , 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 , Cracow , Poland , 5/07/20 . https://doi.org/10.1109/EuroSimE48426.2020.9152713
NO conference
NO Publisher Copyright: © 2020 IEEE.
NO This work was partly funded by the EC project GREENDIAMOND (H2020-LCE-2014-3 GA no. 640947), the Generalitat de Catalunya (AGAUR Contract no. 2017-SGR-1384), the Spanish Ministry of Science and Innovation (Project HIPERCELLS no. RTI2018-098392-B-I00) and Consejo Superior de Investigaciones Científicas (Projects POWERPACK no.202050E037 and no. 201950E036). References 1. J.Lutz,H.Schlangenotto,U.Scheuermann,and R.DeDoncker, SemiconductorPowerDevices: Physics, Characteristics,Reliability, 2nd ed. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011, pp. 2-3.
DS TECNALIA Publications
RD 29 jul 2024