TY  - JOUR
AU  - Jordà, Xavier
AU  - Perpiñà, Xavier
AU  - Vellvehi, Miquel
AU  - Coleto, Javier
PY  - 2008
DO  - 10.1109/TDMR.2008.2005299
SN  - 1530-4388
UR  - https://hdl.handle.net/11556/4130
AB  - Thermal simulation is, nowadays, a basic tool to predict temperature distributions and heat fluxes of complex packages and modules. These variables are of main importance in high-power assemblies to analyze and predict their reliability limits....
LA  - eng
TI  - Power-substrate static thermal characterization based on a test chip
TY  - journal article
ER  -