RT Journal Article
T1 Power-substrate static thermal characterization based on a test chip
A1 Jordà, Xavier
A1 Perpiñà, Xavier
A1 Vellvehi, Miquel
A1 Coleto, Javier
AB Thermal simulation is, nowadays, a basic tool to predict temperature distributions and heat fluxes of complex packages and modules. These variables are of main importance in high-power assemblies to analyze and predict their reliability limits. Nevertheless, the simulation results can be inaccurate due to the uncertainty of the values of the physical parameters involved in the models, as it is the case for the thermal conductivity of the dielectric layers (ceramics and composites) of the main families of power substrates [direct copper bonded (DCB) and insulated metal substrate (IMS)]. We propose a methodology for the in situ determination of these thermal conductivities under true operation conditions. Three test assemblies based on a thermal test chip and different types of power substrates (two IMS and one DCB) have been characterized in order to deduce their thermal resistance. Three-dimensional numerical models of the assemblies have also been developed. Thereby, the thermal conductivity of the critical layers is derived by minimizing the error between the experimental and the simulated thermal resistances. From the subsequent simulation results, the vertical temperature distributions are analyzed in order to predict the thermal stresses of the different layers inside the substrates.
SN 1530-4388
YR 2008
FD 2008-12-01
LK https://hdl.handle.net/11556/4130
UL https://hdl.handle.net/11556/4130
LA eng
NO Jordà , X , Perpiñà , X , Vellvehi , M & Coleto , J 2008 , ' Power-substrate static thermal characterization based on a test chip ' , IEEE Transactions on Device and Materials Reliability , vol. 8 , no. 4 , pp. 671-679 . https://doi.org/10.1109/TDMR.2008.2005299
NO Publisher Copyright: © 2008 IEEE.
NO Manuscript received May 15, 2008. Current version published January 8, 2009. This work was supported in part by the Spanish Ministry of Science under the GICSERV Program, Project 2006-5-0I-044, and in part by the Consejo Superior de Investigaciones Científicas (CSIC) under a contract of the Program “Junta para la Ampliación de Estudios” (JAE-Doc).
DS TECNALIA Publications
RD 29 jul 2024