TY  - CONF
AU  - Coleto, J.
AU  - Maudes, J.
AU  - Goñi, J.
AU  - Marcos, J.
AU  - Calvin, J.
AU  - Costas, F.
PY  - 2003
DO  - 10.4028/www.scientific.net/msf.426-432.2151
SN  - 0255-5476
UR  - https://hdl.handle.net/11556/3047
AB  - A novel method for manufacturing AMC based packages for Monolithic Microwave Integrated Circuits (MMIC) applications has been developed by INASMET FOUNDATION and MIER COMUNICACIONES S.A. for space applications. Major problems associated to...
LA  - eng
TI  - Novel electronic packages made of highly loaded SiC particle aluminium based composites for space applications
TY  - conference output
ER  -