RT Conference Proceedings
T1 Novel electronic packages made of highly loaded SiC particle aluminium based composites for space applications
A1 Coleto, J.
A1 Maudes, J.
A1 Goñi, J.
A1 Marcos, J.
A1 Calvin, J.
A1 Costas, F.
AB A novel method for manufacturing AMC based packages for Monolithic Microwave Integrated Circuits (MMIC) applications has been developed by INASMET FOUNDATION and MIER COMUNICACIONES S.A. for space applications. Major problems associated to conventional Kovar or Copper Tungsten packages for electronic applications are poor heat dissipation and heavy weight. Based on the increasing need for high power dissipation and higher electronic components density in electronic devices for space applications (Phase arrays, etc), the present work has targeted the development of a new manufacturing process of multicavity packages made of aluminium matrix composites (AMCS) highly loaded with SiC particles, in which heat dissipation is notably increased and weight is lowered. Manufacturing method and new AMCS are more competitive in terms of properties/price ratio, in comparison with similar materials presently produced by metal infiltration techniques, due to the simplicity and high productivity of the novel shaping technology developed. Multicavity packages and cover lids were manufactured through a near net shape technology. Machining to net shape is performed with PCD tools to get requirements of finishing. A double Ni/Au electroplating is performed on the packages before integration of hybrid microwaves and package closing. External visual inspection, electrical and thermal resistance measurements are performed in order to confirm the validity of hybrid microwaves integration.
SN 0255-5476
YR 2003
FD 2003
LK https://hdl.handle.net/11556/3047
UL https://hdl.handle.net/11556/3047
LA eng
NO Coleto , J , Maudes , J , Goñi , J , Marcos , J , Calvin , J & Costas , F 2003 , ' Novel electronic packages made of highly loaded SiC particle aluminium based composites for space applications ' , Materials Science Forum , vol. 426-432 , no. 3 , pp. 2151-2156 . https://doi.org/10.4028/www.scientific.net/msf.426-432.2151
DS TECNALIA Publications
RD 29 jul 2024