RT Journal Article
T1 Effect of the incorporation of interfacial elements on the thermophysical properties of Cu/VGCNFs composites
A1 Barcena, J.
A1 Garcia de Cortazar, M.
A1 Seddon, R.
A1 Lloyd, J. C.
A1 Torregaray, A.
A1 Coleto, J.
AB Vapour grown carbon nanofibres exhibit high mechanical properties and thermal conductivities. Therefore they are potential reinforcements in composites materials for high strength and high thermal conductivity applications. A problem not yet solved is the promotion of an improved copper/carbon interface. Several strategies have been envisaged for the incorporation of alloying elements (Ni, Co, B and Ti) at the interface. These techniques are based on duplex electroless plating coatings (combination of Cu and Ni or Cu and Co), electroless plating of alloys (Cu-B) and addition of metal nanoparticles (Ti) to Cu matrix deposited by electroless plating. The effect of the incorporation of these metallic elements on the microstructure and thermophysical properties is discussed. B and Ti lead to higher interaction at the Cu/C interface over Ni and Co. This allows the reduction of the coefficient of thermal expansion but regarding the thermal conductivity it was not possible to obtain a value higher than that of copper.
SN 0266-3538
YR 2010
FD 2010-12-31
LA eng
NO Barcena , J , Garcia de Cortazar , M , Seddon , R , Lloyd , J C , Torregaray , A & Coleto , J 2010 , ' Effect of the incorporation of interfacial elements on the thermophysical properties of Cu/VGCNFs composites ' , Composites Science and Technology , vol. 70 , no. 16 , pp. 2258-2262 . https://doi.org/10.1016/j.compscitech.2010.05.025
NO This study was funded by the European Commission grant project “New Materials for Extreme Environments – ExtreMat”, contract ref. NMP3-CT-2004-500253” and by the Spanish ministry of science and education (MEC) through the grant project: “Nuevos materiales para encapsulado de dispositivos de SiC de muy alta potencia, temperatura y frecuencia”, ref. TEC2005-07937-C02-02/MIC. The help of Dr. Neubauer (Austrian Institute of Technology) in the measurement of the thermal expansion and conductivity is also appreciated.
DS TECNALIA Publications
RD 29 jul 2024