Innovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applications

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dc.contributor.authorBarcena, J.
dc.contributor.authorMerveille, C.
dc.contributor.authorMaudes, J.
dc.contributor.authorVellvehi, M.
dc.contributor.authorJorda, X.
dc.contributor.authorObieta, I.
dc.contributor.authorGuraya, C.
dc.contributor.authorBilbao, L.
dc.contributor.authorJiménez, C.
dc.contributor.authorColeto, J.
dc.contributor.institutionEXTREMAT
dc.contributor.institutionPRINTEX
dc.contributor.institutionTecnalia Research & Innovation
dc.contributor.institutionMercado
dc.date.accessioned2024-07-24T11:55:23Z
dc.date.available2024-07-24T11:55:23Z
dc.date.issued2006
dc.description.abstractDevices based on wide-bandgap semiconductors such as SiC or GaN allow high power densities and elevated working temperatures. Here we present an innovative package for high-power electronics, within the framework of an ESA-contracted project. The paper shows the housing concept, design study, materials selection, manufacturing method and first test results. Materials are selected for their high thermal conductivity (TC) and low coefficient of thermal expansion (CTE). Several materials were selected: AlN was selected as substrate material, and novel metal-matrix composites (MMCs) based on Cu-Diamond and CuVapour Grown Carbon Nanofibres (VGCNFs) were evaluated as heat-sink materials. Subsequently, a complete bonding study between ceramic materials and the MMCs was performed. In order to obtain fully dense materials AlN was manufactured by pressureless sintering, while the MMCs parts were manufactured by hot-pressing. The MMCs powders were obtained by an electroless plating process. Preliminary characterisation of the housing and its parts show encouraging results as a solution for high-power devices working at temperatures up to 300 °C. TC near 500W/mK and CTEsof around 10 ppm/K. have been obtained. These are comparable to the state-of-the-art materials. Out-gassing, thermal cycling and hermeticity tests of the packages were performed. The presented new packaging solutions are showing great prorrise for space applications such as high -frequency power amplifiers for satellite communications and for radar transmitters, and have started to generate an interest from commercial space-systemmanufacturers.en
dc.description.sponsorshipThe research group would like to thank ESA/ESTEC for the grant of project “Power and thermal management of wide bandgap semiconductors” Ref: AO4349 the results of which are the core of this paper. J. Barcena also thanks Education, University and Research Department of Basque Country government.
dc.description.statusPeer reviewed
dc.format.extent9
dc.identifier.citationBarcena , J , Merveille , C , Maudes , J , Vellvehi , M , Jorda , X , Obieta , I , Guraya , C , Bilbao , L , Jiménez , C & Coleto , J 2006 , Innovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applications . in AIAA 57th International Astronautical Congress, IAC 2006 . AIAA 57th International Astronautical Congress, IAC 2006 , vol. 8 , American Institute of Aeronautics and Astronautics Inc. , pp. 5549-5557 , AIAA 57th International Astronautical Congress, IAC 2006 , Valencia , Spain , 2/10/06 . https://doi.org/10.2514/6.iac-06-c2.8.07
dc.identifier.citationconference
dc.identifier.doi10.2514/6.iac-06-c2.8.07
dc.identifier.isbn9781605600390
dc.identifier.urihttps://hdl.handle.net/11556/2508
dc.identifier.urlhttp://www.scopus.com/inward/record.url?scp=40549111027&partnerID=8YFLogxK
dc.language.isoeng
dc.publisherAmerican Institute of Aeronautics and Astronautics Inc.
dc.relation.ispartofAIAA 57th International Astronautical Congress, IAC 2006
dc.relation.ispartofseriesAIAA 57th International Astronautical Congress, IAC 2006
dc.relation.projectIDESTEC, AO4349
dc.relation.projectIDEuropean Space Agency, ESA
dc.rightsinfo:eu-repo/semantics/restrictedAccess
dc.subject.keywordsSpace and Planetary Science
dc.subject.keywordsAerospace Engineering
dc.subject.keywordsSDG 9 - Industry, Innovation, and Infrastructure
dc.titleInnovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applicationsen
dc.typeconference output
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