Simulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devices

Simple item page
dc.contributor.authorFuste, N.
dc.contributor.authorAvino, O.
dc.contributor.authorVellvehi, M.
dc.contributor.authorPerpina, X.
dc.contributor.authorGodignon, P.
dc.contributor.authorSeddon, R.
dc.contributor.authorObieta, I.
dc.contributor.authorMaudes, J.
dc.contributor.authorJorda, X.
dc.contributor.institutionPOLIMEROS
dc.contributor.institutionTecnalia Research & Innovation
dc.contributor.institutionPRINTEX
dc.date.accessioned2024-07-24T11:57:49Z
dc.date.available2024-07-24T11:57:49Z
dc.date.issued2020-07
dc.descriptionPublisher Copyright: © 2020 IEEE.
dc.description.abstractDiamond is one of the best wide band-gap semiconductor materials available for high power devices development in terms of high current capability, high temperature operability, breakdown voltage and switching speed. Unfortunately, fabrication technology for diamond devices is still experimental and immature. Furthermore, one of the most critical fields to be addressed for practical diamond devices implementation concerns the development of power packaging solutions, given that limitations in the device packaging would hinder the performance of the device and act as the limiting factor for a technology that is still in a development state. Of special interest are the induced stresses and deformations caused by the thermo-mechanical mismatch between materials. These stresses and strains will be considerably different than the ones obtained with silicon or SiC dies, and it will be especially noticeable in high temperature applications due to the higher temperature swings and the reliability constraints that arise from the coefficient of thermal expansion mismatch and stiffness difference. In this paper, a Finite Element Method for thermo-mechanical simulation of a high-temperature thermal cycle for a full-stacked diamond die SOT-227 power module is introduced and compared to silicon- and SiC-die modules. Special interest is addressed to the analysis of stress and deformations generated in the die and die-attach solder layer.en
dc.description.sponsorshipThis work was partly funded by the EC project GREENDIAMOND (H2020-LCE-2014-3 GA no. 640947), the Generalitat de Catalunya (AGAUR Contract no. 2017-SGR-1384), the Spanish Ministry of Science and Innovation (Project HIPERCELLS no. RTI2018-098392-B-I00) and Consejo Superior de Investigaciones Científicas (Projects POWERPACK no.202050E037 and no. 201950E036). References 1. J.Lutz,H.Schlangenotto,U.Scheuermann,and R.DeDoncker, SemiconductorPowerDevices: Physics, Characteristics,Reliability, 2nd ed. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011, pp. 2-3.
dc.description.statusPeer reviewed
dc.identifier.citationFuste , N , Avino , O , Vellvehi , M , Perpina , X , Godignon , P , Seddon , R , Obieta , I , Maudes , J & Jorda , X 2020 , Simulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devices . in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 . , 9152713 , 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 , Institute of Electrical and Electronics Engineers Inc. , 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 , Cracow , Poland , 5/07/20 . https://doi.org/10.1109/EuroSimE48426.2020.9152713
dc.identifier.citationconference
dc.identifier.doi10.1109/EuroSimE48426.2020.9152713
dc.identifier.isbn9781728160498
dc.identifier.urihttps://hdl.handle.net/11556/2773
dc.identifier.urlhttp://www.scopus.com/inward/record.url?scp=85090412032&partnerID=8YFLogxK
dc.language.isoeng
dc.publisherInstitute of Electrical and Electronics Engineers Inc.
dc.relation.ispartof2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
dc.relation.ispartofseries2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
dc.relation.projectIDEuropean Commission, EC, 640947
dc.relation.projectIDGeneralitat de Catalunya
dc.relation.projectIDAgència de Gestió d'Ajuts Universitaris i de Recerca, AGAUR, 2017-SGR-1384
dc.relation.projectIDConsejo Superior de Investigaciones Científicas, CSIC, 202050E037-201950E036
dc.relation.projectIDMinisterio de Ciencia e Innovación, MICINN, RTI2018-098392-B-I00
dc.rightsinfo:eu-repo/semantics/restrictedAccess
dc.subject.keywordsFluid Flow and Transfer Processes
dc.subject.keywordsElectrical and Electronic Engineering
dc.subject.keywordsComputational Mechanics
dc.subject.keywordsMechanical Engineering
dc.subject.keywordsSafety, Risk, Reliability and Quality
dc.subject.keywordsElectronic, Optical and Magnetic Materials
dc.subject.keywordsModeling and Simulation
dc.titleSimulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devicesen
dc.typeconference output
Files