Browsing by Keyword "Buckypaper"
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Item Enhancement of electrical conductivity of composite structures by integration of carbon nanotubes via bulk resin and/or buckypaper films(2017-08-01) Gaztelumendi, Idoia; Chapartegui, Maialen; Seddon, Richard; Flórez, Sonia; Pons, François; Cinquin, Jacques; Tecnalia Research & Innovation; POLIMEROSThis study describes two approaches for the incorporation of carbon nanotubes (CNTs) in carbon fibre reinforced polymer (CFRP) composites, through the addition of the CNTs in the bulk resin and by the addition of CNT-based buckypaper (BP) in the CFRP structure. Several laminates were successfully manufactured integrating these two approaches, where a significant improvement of the electrical conductivity (EC) values was found. Additionally, in order to compare different surface preparations and testing methods, a cross check of EC test was carried out among different laboratories. This characterization was complemented with scanning electron microscopy (SEM) analyses, results of which were used to rule out a complete filtering effect of the CNTs. Furthermore, interlaminar shear strength (ILSS) tests were also performed, with the aim of assessing the mechanical behavior of the different configurations.Item Using an embedded Buckypaper to monitor mode I crack growth in bonded joints(2022) Gaztelumendi, Idoia; Villaverde, H.; Pérez, B.; Chapartegui, M.; Flórez, S.; Manterola, J.; Zurbitu, J.; POLIMEROS; PRINTEXStructural Health Monitoring (SHM) systems are commonly integrated in bonded joints for different applications in order to detect and predict potential fatigue and damages caused by internal and external agents they are subjected to during their operation life. However, each of the current SHM systems presents some drawbacks, as the reduction of structural properties or the difficulty in its implementation. This work deals with the use of a Carbon Nanotube film (Bukypaper) as a sensor in double cantilever beam (DCB) bonded joint specimens for crack growth monitoring purposes. Buckypaper (BP) sheets were manufactured and integrated in adhesive film layers and its integration quality was studied by Scanning Electron Microscopy (SEM). The effect of the integration of different thickness BPs in the mechanical performance of the bonded joints was also assessed performing DCB fracture tests. Also, electro-mechanical tests were conducted using the BP as the sensor, monitoring the output in the electrical resistance during the crack propagation. It was observed the capability of BP to detect and locate the damage during the test with a linear dependence between the electrical resistance measured in the BP and the deduced crack growth, proving the potential of the BP to monitor self-sensing bonded joints.