Browsing by Author "Maudes, J."
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Item Advanced packaging for GaN high power electronics(2008) Marcos, J.; Cobo, I.; Barcena, J.; Maudes, J.; Amado, R.; Vellvehi, M.; Jorda, X.; Obieta, I.; Guraya, C.; Bilbao, L.; Jiménez, C.; Coleto, J.; Tecnalia Research & Innovation; EXTREMAT; PRINTEX; MercadoDevices based on wide-bandgap semiconductors such as SiC or GaN allow high power densities and elevated working temperatures. Here we present an innovative package for high-power electronics, within the framework of an ESA-contracted project. The housing concept, design study, materials selection, manufacturing method and first test results are the parameters to be followed in order to get this innovative electronic package. Materials are selected for their high thermal conductivity (TC) and low coefficient of thermal expansion (CTE). Several materials were selected: A1N was selected as substrate material, and novel metal-matrix composites (MMCs) based on Cu-Diamond were evaluated as heat-sink materials. Determination of the final dimensions of the housings according to the new design was required to get a complete bonding. This new heat sink geometry has been validated and the new components fabrication has been already started. An improved surface quality has been achieved, which will increase the contact between the heat sink and the aluminum spreader for electrical characterization. Subsequently, a complete bonding study between ceramic materials and the MMCs was performed. Determination of the final dimensions of the housings according to the new design was required to get a complete bonding. This new MMCs heat sink geometry has been validated and the new components fabrication has been selected. An improved surface quality has been achieved, which will increase the contact between the heat sink and the aluminum spreader for high temperature electrical characterization. In order to obtain fully dense materials A1N was manufactured by pressureless sintering, while the MMCs parts were manufactured by hot-pressing. The MMCs powders were obtained by an electroless plating process. Preliminary characterization of the housing and its parts show encouraging results as a solution for high-power devices working at temperatures up to 400 °C. TC near 500W/mK and CTEs of around 10 ppm/K have been obtained. These are comparable to the stateof-the-art materials. Out-gassing, thermal cycling and hermeticity tests of the packages and high temperature electrical characterization of the electronic paths and global package were performed. The presented new packaging solutions are showing great promise for space applications such as high-frequency power amplifiers for satellite communications and for radar transmitters, and have started to generate an interest from commercial space-system manufacturers.Item The effect of the raw materials and processing conditions on the properties of titanium foams(European Powder Metallurgy Association (EPMA), 2011) Agote, I.; Maudes, J.; Lagos, M. A.; Calero, J. A.; EXTREMAT; PRINTEXMetal foams possess a unique combination of properties, such as air and water permeability, impact energy absorption capacity, unusual acoustic properties, low thermal conductivity, good electrical insulating properties and high stiffness with very low specific weight. Titanium foams, in particular, have interesting properties in different industrial sectors such as aerospace as structural parts or in the biomedical field as implants. This work studies the manufacturing process of the foams using space holder technique (sodium chloride, NaCl)), as well as their characterisation. The effect of titanium powder characteristics and amount of space holder has been studied. It was found that for a constant NaCl amount, the powder characteristics greatly influence the final porosity of the foam, the pore interconnecting channel size as well as mechanical properties. It was also found that the amount of NaCl greatly influences the final porosity of the foam. It was observed that the pore geometry is directly linked to the space holder particle shape. Two types of porosity have been obtained: macroporosity (originated from the space holder) and micro-porosity (formed as a consequence of the sintering conditions). Finally, it has been concluded that by varying the titanium powder characteristics and space holder amount it is possible to tailor the properties of the foam to match the bone requirements: porosity, microstructure and mechanical properties, whilst also minimising the stress shielding produced by the Young's modulus mismatch between the bone and the implant.Item Fabrication de mousses métalliques à cellules ouvertes ou fermées, par les voies de la fonderie, et applications de ces mousses(2004-10) Coleto, J.; Goñi, J.; Maudes, J.; Leizaola, I.; Mercado; Centros PRE-FUSION TECNALIA - (FORMER); PRINTEX; EXTREMATDuring the last two decades, research and development in cellular materials and metallic foams has been quite intensive, leading to a great number of technical papers, proceedings of conferences and scientific books, as wet as a number or European companies offering commercial products. Among the different manufacturing technologies developed for the production of open and closed cell metal foams, the present paper will give an overview of those based on foundry routes, as Well as a more detailed information of the activities performed at INASMET for the production of non- ferrous metal foams by melt processes along the last years. Closed cell metal foams are produced by foaming foamable precursors into moulds, while open pore metal foams are produced through investment casting techniques. The use of close cell metal foams produced in moulds for automotive, aeronautic and space applications for impact energy absorption or noise attenuation, and applications of open pore metallic foams as heat exchangers in industrial devices or cooling in power electronics will be reviewed.Item Innovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applications(American Institute of Aeronautics and Astronautics Inc., 2006) Barcena, J.; Merveille, C.; Maudes, J.; Vellvehi, M.; Jorda, X.; Obieta, I.; Guraya, C.; Bilbao, L.; Jiménez, C.; Coleto, J.; EXTREMAT; PRINTEX; Tecnalia Research & Innovation; MercadoDevices based on wide-bandgap semiconductors such as SiC or GaN allow high power densities and elevated working temperatures. Here we present an innovative package for high-power electronics, within the framework of an ESA-contracted project. The paper shows the housing concept, design study, materials selection, manufacturing method and first test results. Materials are selected for their high thermal conductivity (TC) and low coefficient of thermal expansion (CTE). Several materials were selected: AlN was selected as substrate material, and novel metal-matrix composites (MMCs) based on Cu-Diamond and CuVapour Grown Carbon Nanofibres (VGCNFs) were evaluated as heat-sink materials. Subsequently, a complete bonding study between ceramic materials and the MMCs was performed. In order to obtain fully dense materials AlN was manufactured by pressureless sintering, while the MMCs parts were manufactured by hot-pressing. The MMCs powders were obtained by an electroless plating process. Preliminary characterisation of the housing and its parts show encouraging results as a solution for high-power devices working at temperatures up to 300 °C. TC near 500W/mK and CTEsof around 10 ppm/K. have been obtained. These are comparable to the state-of-the-art materials. Out-gassing, thermal cycling and hermeticity tests of the packages were performed. The presented new packaging solutions are showing great prorrise for space applications such as high -frequency power amplifiers for satellite communications and for radar transmitters, and have started to generate an interest from commercial space-systemmanufacturers.Item Innovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applications(2008-03) Barcena, J.; Maudes, J.; Vellvehi, M.; Jorda, X.; Obieta, I.; Guraya, C.; Bilbao, L.; Jiménez, C.; Merveille, C.; Coleto, J.; EXTREMAT; PRINTEX; Tecnalia Research & Innovation; MercadoDevices based on wide-bandgap semiconductors such as SiC or GaN allow high power densities and elevated working temperatures. Here we present an innovative package for high-power electronics, within the framework of an ESA-contracted project. The paper shows the housing concept, design study, materials selection, manufacturing method and first test results. Materials are selected for their high thermal conductivity (TC) and low coefficient of thermal expansion (CTE). Several materials were selected: AlN was selected as substrate material, and novel metal-matrix composites (MMCs) based on Cu-diamond and Cu-vapour grown carbon nanofibres (VGCNFs) were evaluated as heat-sink materials. Subsequently, a complete bonding study between ceramic materials and MMCs was performed. In order to obtain fully dense materials AlN was manufactured by pressureless sintering, while the MMC parts were manufactured by hot-pressing. The MMC powders were obtained by an electroless plating process. Preliminary characterisation of the housing and its parts show encouraging results as a solution for high-power devices working at temperatures up to 300 °C. TC near 500 W/mK and CTEs of around 10 ppm/K have been obtained. These are comparable to the state-of-the-art materials. Out-gassing, thermal cycling and hermeticity tests of the packages were performed. The presented new packaging solutions show great promise for space applications such as high-frequency power amplifiers for satellite communications and for radar transmitters, and have started to generate an interest from commercial space-system manufacturers.Item Novel electronic packages made of highly loaded SiC particle aluminium based composites for space applications(2003) Coleto, J.; Maudes, J.; Goñi, J.; Marcos, J.; Calvin, J.; Costas, F.; Mercado; PRINTEX; Centros PRE-FUSION TECNALIA - (FORMER); Tecnalia Research & InnovationA novel method for manufacturing AMC based packages for Monolithic Microwave Integrated Circuits (MMIC) applications has been developed by INASMET FOUNDATION and MIER COMUNICACIONES S.A. for space applications. Major problems associated to conventional Kovar or Copper Tungsten packages for electronic applications are poor heat dissipation and heavy weight. Based on the increasing need for high power dissipation and higher electronic components density in electronic devices for space applications (Phase arrays, etc), the present work has targeted the development of a new manufacturing process of multicavity packages made of aluminium matrix composites (AMCS) highly loaded with SiC particles, in which heat dissipation is notably increased and weight is lowered. Manufacturing method and new AMCS are more competitive in terms of properties/price ratio, in comparison with similar materials presently produced by metal infiltration techniques, due to the simplicity and high productivity of the novel shaping technology developed. Multicavity packages and cover lids were manufactured through a near net shape technology. Machining to net shape is performed with PCD tools to get requirements of finishing. A double Ni/Au electroplating is performed on the packages before integration of hybrid microwaves and package closing. External visual inspection, electrical and thermal resistance measurements are performed in order to confirm the validity of hybrid microwaves integration.Item Optical sensors based on polymeric nanofibers layers created by electrospinning(2018) Ponce-Alcántara, S.; Martín-Sánchez, D.; Pérez-Márquez, A.; Maudes, J.; Murillo, N.; García-Rupérez, J.; PRINTEX; Tecnalia Research & InnovationPorous materials have become ideal candidates for the creation of optical sensors that are able to reach extremely high sensitivities, due to both the possibility to infiltrate the target substances on them and to their large surface-to-volume ratio. In this work, we present a new alternative for the creation of porous optical sensors based on the use of polymeric nanofibers (NFs) layers fabricated by electrospinning. Polyamide 6 (PA6) NFs layers with average diameters lower than 30 nm and high porosities have been used for the creation of Fabry-Pérot optical sensing structures, which have shown an experimental sensitivity up to 1060 nm/RIU (refractive index unit). This high sensitivity, together with the low production cost and the possibility to be manufactured over large areas, make NFs-based structures a very promising candidate for the development of low-cost and high performance optical sensors.Item Phase change materials and thermosensitive painting: Application on smart thermal protection systems(2006) Coleto, J.; Bausá, M.; Maudes, J.; Salmon, T.; Martinez, L.; Passaro, A.; Ritter, H.; Mercado; PRINTEXIn order to promote new ideas and assess novel alternatives for TPS concepts, ESA has launched an exploratory study on Smart TPS for future re-entry vehicles. Within this context, the objectives of the present work have been achieved within two phases: (1) definition of Smart TPS concepts, study and selection of the most promising ones and (2) demonstration of their feasibility. After a trade-off approach, where the smart concepts have been evaluated versus system aspects, the two most promising were selected for proof-of-concept. The first one, based on Phase Change Materials (PCMs), provides increased safety by preventing the formation of hot spots in the primary structure. The second one is a thermosensitive painting able to retrieve information of the thermal history of the TPS after re-entry, enabling easier maintenance. Both concepts have been tested under simulated re-entry conditions at high temperature. It has been demonstrated that the use of PCM restricts the temperature achieved in critical zones of the primary structure notably lower than that achieved without PCM. In addition, outstanding accuracy of the thermal paints has been confirmed by comparison with thermocouples measurements. Excellent adherence with the substrate has been also confirmed under thermal cycling and plasma conditions.Item Powder metallurgy based manufacture of copper/carbon nanofibers composites(European Powder Metallurgy Association (EPMA), 2008) Barcena, J.; Martinez, R.; de Cortazar, M. G.; Egizabal, P.; Maudes, J.; Caro, I.; Coleto, J.; EXTREMAT; CIRMETAL; Tecnalia Research & Innovation; PRINTEX; PROMETAL; MercadoVapour Grown Carbon Nanofibers (VGCNFs) exhibit excellent mechanical and thermophysical properties. Therefore they are one of the most promising reinforcing materials for metal matrix composites in multiple applications, like thermal management or friction materials. The continuous manufacturing process of VGCNFs enables an immediate availability and excellent performance-to-cost ratio for the mass production of industrial components, over other candidates such as carbon fibers or nanotubes (CNTs). The present paper describes a non conventional procedure based on electroless plating for obtaining composite powders with excellent homogeneity and distribution of the nanofibers. At this stage the influence in the incorporation of nanofibers from different manufacturers has been studied in detail. A comparative study between different powder metallurgy consolidation techniques is given: pressureless sintering, uniaxial hot-pressing, hot isostatic pressing and spark plasma sintering. Complete microstructural characterization (SEM and TEM) and oxidation assessment were carried-out.Item Simulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devices(Institute of Electrical and Electronics Engineers Inc., 2020-07) Fuste, N.; Avino, O.; Vellvehi, M.; Perpina, X.; Godignon, P.; Seddon, R.; Obieta, I.; Maudes, J.; Jorda, X.; POLIMEROS; Tecnalia Research & Innovation; PRINTEXDiamond is one of the best wide band-gap semiconductor materials available for high power devices development in terms of high current capability, high temperature operability, breakdown voltage and switching speed. Unfortunately, fabrication technology for diamond devices is still experimental and immature. Furthermore, one of the most critical fields to be addressed for practical diamond devices implementation concerns the development of power packaging solutions, given that limitations in the device packaging would hinder the performance of the device and act as the limiting factor for a technology that is still in a development state. Of special interest are the induced stresses and deformations caused by the thermo-mechanical mismatch between materials. These stresses and strains will be considerably different than the ones obtained with silicon or SiC dies, and it will be especially noticeable in high temperature applications due to the higher temperature swings and the reliability constraints that arise from the coefficient of thermal expansion mismatch and stiffness difference. In this paper, a Finite Element Method for thermo-mechanical simulation of a high-temperature thermal cycle for a full-stacked diamond die SOT-227 power module is introduced and compared to silicon- and SiC-die modules. Special interest is addressed to the analysis of stress and deformations generated in the die and die-attach solder layer.