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dc.contributor.authorBozó, Éva
dc.contributor.authorErvasti, Henri
dc.contributor.authorHalonen, Niina
dc.contributor.authorShokouh, Seyed Hossein Hosseini
dc.contributor.authorTolvanen, Jarkko
dc.contributor.authorPitkänen, Olli
dc.contributor.authorJärvinen, Topias
dc.contributor.authorPálvölgyi, Petra S.
dc.contributor.authorSzamosvölgyi, Ákos
dc.contributor.authorSápi, András
dc.contributor.authorKonya, Zoltan
dc.contributor.authorZaccone, Marta
dc.contributor.authorMontalbano, Luana
dc.contributor.authorDe Brauwer, Laurens
dc.contributor.authorNair, Rakesh
dc.contributor.authorMartínez-Nogués, Vanesa
dc.contributor.authorSan Vicente Laurent, Leire
dc.contributor.authorDietrich, Thomas
dc.contributor.authorFernández de Castro, Laura
dc.contributor.authorKordas, Krisztian
dc.date.accessioned2021-11-03T11:56:33Z
dc.date.available2021-11-03T11:56:33Z
dc.date.issued2021
dc.identifier.citationBozó, Éva, Henri Ervasti, Niina Halonen, Seyed Hossein Hosseini Shokouh, Jarkko Tolvanen, Olli Pitkänen, Topias Järvinen, et al. “Bioplastics and Carbon-Based Sustainable Materials, Components, and Devices: Toward Green Electronics.” ACS Applied Materials & Interfaces 13, no. 41 (October 5, 2021): 49301–49312. doi:10.1021/acsami.1c13787.en
dc.identifier.issn1944-8244en
dc.identifier.urihttp://hdl.handle.net/11556/1219
dc.description.abstractThe continuously growing number of short-life electronics equipment inherently results in a massive amount of problematic waste, which poses risks of environmental pollution, endangers human health, and causes socioeconomic problems. Hence, to mitigate these negative impacts, it is our common interest to substitute conventional materials (polymers and metals) used in electronics devices with their environmentally benign renewable counterparts, wherever possible, while considering the aspects of functionality, manufacturability, and cost. To support such an effort, in this study, we explore the use of biodegradable bioplastics, such as polylactic acid (PLA), its blends with polyhydroxybutyrate (PHB) and composites with pyrolyzed lignin (PL), and multiwalled carbon nanotubes (MWCNTs), in conjunction with processes typical in the fabrication of electronics components, including plasma treatment, dip coating, inkjet and screen printing, as well as hot mixing, extrusion, and molding. We show that after a short argon plasma treatment of the surface of hot-blown PLA-PHB blend films, percolating networks of single-walled carbon nanotubes (SWCNTs) having sheet resistance well below 1 kω/□ can be deposited by dip coating to make electrode plates of capacitive touch sensors. We also demonstrate that the bioplastic films, as flexible dielectric substrates, are suitable for depositing conductive micropatterns of SWCNTs and Ag (1 kω/□ and 1 ω/□, respectively) by means of inkjet and screen printing, with potential in printed circuit board applications. In addition, we exemplify compounded and molded composites of PLA with PL and MWCNTs as excellent candidates for electromagnetic interference shielding materials in the K-band radio frequencies (18.0-26.5 GHz) with shielding effectiveness of up to 40 and 46 dB, respectively.en
dc.description.sponsorshipBusiness Finland (project 1212/31/2020, All green structural electronics), EU Horizon 2020 BBI JU (project 792261, NewPack), and EU Interreg Nord Lapin liitto (project 20201468, Flexible transparent conductive f ilms as electrodes) and Academy of Finland (project 316825, Nigella).en
dc.language.isoengen
dc.publisherAmerican Chemical Societyen
dc.titleBioplastics and Carbon-Based Sustainable Materials, Components, and Devices: Toward Green Electronicsen
dc.typearticleen
dc.identifier.doi10.1021/acsami.1c13787en
dc.relation.projectIDinfo:eu-repo/grantAgreement/EC/H2020/792261/EU/Development of new Competitive and Sustainable Bio-Based Plastics/NEWPACKen
dc.rights.accessRightsopenAccessen
dc.subject.keywordsBioplasticsen
dc.subject.keywordsBlendsen
dc.subject.keywordsCompositesen
dc.subject.keywordsPyrolyzed ligninen
dc.subject.keywordsElectrodesen
dc.subject.keywordsTouch screensen
dc.subject.keywordsEMI shieldingen
dc.subject.keywordsElectrical devicesen
dc.identifier.essn1944-8252en
dc.issue.number41en
dc.journal.titleACS Applied Materials & Interfacesen
dc.page.final49312en
dc.page.initial49301en
dc.volume.number13en


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