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dc.contributor.authorMartinez, Jabier
dc.contributor.authorQuintano, Nuria
dc.contributor.authorRuiz, Alejandra
dc.contributor.authorSantamaria, Izaskun
dc.contributor.authorde Soria, Iker Martinez
dc.contributor.authorArias, Jose
dc.date.accessioned2021-09-21T14:47:02Z
dc.date.available2021-09-21T14:47:02Z
dc.date.issued2021
dc.identifier.citationMartinez, Jabier, Nuria Quintano, Alejandra Ruiz, Izaskun Santamaria, Iker Martinez de Soria, and Jose Arias. “Security Debt: Characteristics, Product Life-Cycle Integration and Items.” 2021 IEEE/ACM International Conference on Technical Debt (TechDebt) (May 2021). doi:10.1109/techdebt52882.2021.00009en
dc.identifier.isbn978-1-6654-1406-7en
dc.identifier.urihttp://hdl.handle.net/11556/1203
dc.description.abstractIndustries from very diverse domains are realising that security should not be treated in a reactive way (e.g., once the cyberattack has happened). This way, security-related requirements and risks need to be continuously managed, and the need of integrating technical measures should be continuously assessed. In some cases, some decisions led, intentionally or unintentionally, to debt related to security aspects. This security debt is thus incurred when limited approaches or solutions are applied to reach the expected security levels of the system in operation. Identifying and making explicit security debt items is a challenge for companies. In this work, we analyse the literature on security debt to provide initial insights on the topic. Concretely, we discuss its definition, identify its most salient characteristics, present approaches for integrating its management in the product life-cycle, and to present categories and examples of security debt items.en
dc.language.isoengen
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en
dc.titleSecurity Debt: Characteristics, Product Life-Cycle Integration and Itemsen
dc.typeconferenceObjecten
dc.identifier.doi10.1109/TechDebt52882.2021.00009en
dc.rights.accessRightsembargoedAccessen
dc.subject.keywordsSecurityen
dc.subject.keywordsTechnical debten
dc.subject.keywordsSecurity debten
dc.journal.titleProceedings - 2021 IEEE/ACM International Conference on Technical Debt, TechDebt 2021en
dc.page.final5en
dc.page.initial1en
dc.identifier.esbn978-1-6654-1405-0en
dc.conference.title4th IEEE/ACM International Conference on Technical Debt, TechDebt 2021, Virtual, Online, 19 May 2021 - 21 May 2021en


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