%0 Journal Article %A Kovac, P. %A Kopera, L. %A Melisek, T. %A Sarmiento, G. %A Sanz, Santiago %A Brisigotti, S. %A Nardelli, Davide %A Tropeano, Matteo %T Tensile and Bending Strain Tolerance of Ex Situ MgB2/Ni/Cu Superconductor Tape %D 2015 * IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141 USA %X This paper describes the strain tolerance of MgB2/Ni/Cu tape produced by Columbus Superconductors subjected to tension and bending stress. A tension test instrument with freestanding sample was used for stress-strain, I-c-stress, and I-c-strain characteristics at liquid helium temperature. Bending of MgB2/Ni/Cu tape to variable diameters was done at room temperature and in two directions: 1) with a Cu strip on the outer surface (Cu out) of a bent sample; and 2) with a Cu strip on the inner side (Cu in). I-c-bending strain characteristics were measured at 4.2 K and external field B = 6 T oriented perpendicularly to the sample's width. Obtained results have shown the strain limits, which should not be exceeded during the winding process of superconductor containing brittle MgB2 filaments. %@ 1558-2515 %K Bending stress %K critical current degradation %K ex situ MgB2 tape %K neutral axis %K strain tolerances %K tensile stress doi 10.1109/TASC.2014.2379723 %U http://hdl.handle.net/11556/156 %~ GOEDOC, SUB GOETTINGEN